Sponsored by: Emerson
Project Background and Design Goal
Emerson currently attaches their volume inserts into the header body using room-temperature vulcanizing silicon. This silicon limits the maximum operating temperature of their pressure transmitters and poses manufacturing challenges. To remedy this, Emerson needs a volume insert design and prototype that can be retained inside the header body without room-temperature vulcanizing silicon.
Design Constraints
- SIZE: Shall fit into existing HB packaging
- TEMP: GP sensors capable of reaching 200℃
- COMPATIBILITY: Compatible with silicon and inert oil
- PERFORMANCE: Shall not interfere with measurements
- ERGONOMICS: Ergonomic installation methodology
- ELECTRICAL ISOLATION: Maintain electrical isolation with HB
- COST: Less than $0.75/unit at 75,000/year
Design Outcomes
The team designed a volume insert with tabs to self-retain inside the header body. Ultem 2410r, a composite polymer was selected. The design can be easily injection molded at large volumes. ANSYS simulation determined peak stresses during insertion and thermal cycling. These results were correlated with physical tests. The prototype is ready for more rigorous testing prior to product roll-out.
Download the project summary (PDF file).
CAD assembly of the proposed volume insert (yellow) and header body.
Members of the Project Team
Student Team:
- Brady Sahr - Major: Mechanical Engineering
- Nimrod Tesfahiwet - Major: Mechanical Engineering
- Brandon Bui - Major: Mechanical Engineering
- Tyler Bushinski - Major: Mechanical Engineering
Industry Representatives: Nick Meyer
Faculty Advisor: Brodan Richter
Pictured left to right: Brady Sahr, Nimrod Tesfahiwet, Brandon Bui, Tyler Bushinski